Manufacturing Infrastructure
- All
- Surface Mount Technology (SMT)
- Through-Hole Technologies
- Testing & Validation
- Protective Processes
- PCB Routing & De-Paneling
- Box Build Systems
Clean Rooms
Controlled environments for high-reliability builds
- ISO 6 Cleanroom: Dedicated SMT line
- ISO 8 Cleanroom: Box build & testing
- 24×7 temperature & humidity control
Surface Mount Technology (SMT)
Fuji GPX-CII Printer
- 6-sec cycle time
- 10 μm @ 6 sigma alignment accuracy
Surface Mount Technology (SMT)
Fuji NXT-R Mounter
- ±25 μm placement accuracy
- Smart feeder traceability
- Modular, high-speed configuration
Surface Mount Technology (SMT)
JT Reflow Oven
- 15% improved heat transfer efficiency
- Long heating zone for higher throughput
- Nitrogen chamber with O₂ as low as 150 ppm
Surface Mount Technology (SMT)
Koh Young 3D AOI
- 15 μm resolution
- Height + shape + surface inspection
- SPC-driven process improvement
Through-Hole Technologies
Wave Soldering – JT
- Controlled fluxing, preheat & wave height
- Stable solder pot with dross management
Through-Hole Technologies
Selective Soldering – Kurtz
- Programmable nozzle path
- N₂ atmosphere + top/bottom preheating
- Parallel soldering of 4 PCBAs
Testing & Validation
Takaya Flying Probe
- Fixture-less ICT
- Ideal for NPI/low volume
- Detects opens, shorts, polarity, orientation
Testing & Validation
iTest ICT
- High-speed, high-coverage electrical testing
- Detailed reporting for mass production
Testing & Validation
Functional Testing
- Real operating conditions & I/O simulation
- Firmware, interface & performance checks
Protective Processes
Conformal Coating – ANDA
- Selective spray with controlled thickness
- UV/thermal curing
- Protected zones for connectors & no-coat areas
Protective Processes
Potting (1K/2K)
- Controlled mixing, dosing & degassing
- Bubble-free, consistent fill
- Enhanced insulation & durability
PCB Routing & De-Paneling
Aerotech Router
- Router/V-cut/laser processes
- Low-stress PCB separation
- ±0.08 mm cutting precision
Box Build Systems
Expertise in EV & Industrial Electronics
- BMS, BCU, DTU, OBC, VIC
- High-voltage-ready stations with safety interlocks
- Automated screwdriving, gluing & potting
- Recipe-driven cells for variant builds
- MES-enabled zero-paper governance
- Full traceability + poka-yoke + in-line QC
Box Build Systems
Assembly Capabilities
- Harness routing, busbar integration
- Gap fillers, pads & heat sink installation
- Sealing: gaskets, gluing, potting
- Firmware flashing & calibration
- CAN/LIN/RF validation
- ICT/FCT/EOL with torque & vision data logging
